Wiwynn Unveils Double-Wide Rack for Next-Gen AI at OCP 2025


Wiwynn Unveils Double-Wide Rack for Next-Gen AI at OCP 2025

📅 - To address data transmission, power delivery, thermal, and mechanical challenges in high-density computing, the architecture combines an HVDC power rack and busbar, sophisticated liquid cooling, and a signal-integrity-optimized compute/switch layout, driving the future of artificial intelligence and transforming concepts into reality.

Key Innovations

Double-Wide Rack: As computing demand increases, this rack doubles in width to handle expanding chip/module footprints. Four big AI accelerators are arranged side by side in the double-wide compute tray, which supports substrates up to 120 × 150 mm and chips scaling to 9.5 reticle with 12x HBM. The design minimizes cable routing and signal [...][... Check source for end of article ...]
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