Teramount Raises $50M to Meet AI Infrastructure Connectivity Demand


Teramount Raises $50M to Meet AI Infrastructure Connectivity Demand

📅 - Teramount, a provider of scalable fiber-to-chip interconnect solutions for AI, data centers and advanced computing, today announced it has raised $50 million in financing led by new investor Koch Disruptive Technologies (KDT). Existing investors Grove Ventures and several new strategic investors, including AMD Ventures, Hitachi Ventures, Samsung Catalyst Fund and Wistron, joined the round.

AI is driving exponential infrastructure growth, pushing the limits of data movement speed and efficiency. To meet these escalating performance and power demands, the industry must adopt advanced optical interconnects to pass data between compute and networking components. Teramount makes this possible [...][... Check source for end of article ...]
Tags: AI

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