Rambus HBM3-Ready Memory Subsystem Brings Performance for AI/ML

📅 August 17, 2021 - Chips and silicon IP provider Rambus, a global company aiming at making data faster and safer, has announced the release of its Rambus HBM3-ready memory interface subsystem consisting of a fully integrated PHY and digital controller.

Tags: News Telecom AI application performance Artificial Intelligence bandwidth data centers High Performance Computing HPC idc Interface IP machine learning Matt Jones ML Rambus Soo Kyoum Kim telecom

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